Browsing by Author "Noraniza, Saud"
Now showing items 1-3 of 3
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Effect of aging temperature on the intermetallic compound (IMC) formation of Sn-0.7Cu/Si3N4 composite solder
Mohd Arif Anuar, Mohd Salleh; Noraniza, Saud; Najib Saedi, Ibrahim (Trans Tech Publications, 2013)Nowadays, excessive growth intermetallic formation becomes the major issue in electronic packaging industry. The investigation on the effect of aging temperature to the intermetallic compound (IMCs) growth formation for ... -
Effect of aging time towards intermetallic compound (IMC) growth kinetics formation for Sn-0.7Cu-Si3N4 composite solder on copper substrate
Mohd Arif Anuar, Mohd Salleh; Noraniza, Saud; Najib Saedi, Ibrahim (Trans Tech Publications, 2013)The effect of excessive intermetallic growth to the reliability of solder joints become major problem in electronic assemblies industry. In this investigation, we used Sn-0.7Cu/1.0-Si3N4 composite solder to analyze its ... -
SAC-SIC : a new potential lead–free composite solder for green technology
Zawawi, Mahim; Sayyidah Amnah, Musa; Noraniza, Saud; Nurul Razliana, Abdul Razak (Universiti Malaysia Perlis (UniMAP), 2015-04-17)Recently, the development of Sn-Ag-Cu (SAC) has gain attention in electronic packaging industry due to its good reliability in the electronics application. The tin-silver-copper family of alloys has earned a great deal ...