Effect of aging temperature on the intermetallic compound (IMC) formation of Sn-0.7Cu/Si3N4 composite solder
Mohd Arif Anuar, Mohd Salleh
Najib Saedi, Ibrahim
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Nowadays, excessive growth intermetallic formation becomes the major issue in electronic packaging industry. The investigation on the effect of aging temperature to the intermetallic compound (IMCs) growth formation for Sn-0.7Cu/1.0-Si3N4 was studied. Isothermal aging process was carried out for 24 hours, with 5 difference aging temperature from 50°C up to 150°C. It is found that the Cu-Sn IMCs which appear after reflowed process, has grew rapidly when aging temperature was increased up to 125°C and started to reduced after 150°C aging temperature.