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Please use this identifier to cite or link to this item: http://dspace.unimap.edu.my:80/xmlui/handle/123456789/8704
Title: Effect of small addition of Al to SnZn solder alloys
Authors: Nor Azwin, Ahad
Aw, Yah Yun
Keywords: Lead-free solder alloy
SnZn
Al
Microstrucuture
Thermal properties
Malaysian Technical Universities Conference on Engineering and Technology (MUCEET)
Issue Date: 20-May-2009
Publisher: Universiti Malaysia Pahang
Series/Report no.: Proceedings of the Malaysian Technical Universities Conference on Engineering and Technology (MUCEET) 2009
Abstract: The effects of Al on melting, microstructure and hardness properties of Sn9Zn lead free solders were investigated. SnZnAl solder in this study were produced via melting and casting method. Thermal properties (Tm) of the solder alloys were determined by Differential Scanning Calorimetry (DSC), mechanical properties were investigated by using Vickers Hardness and microstructure were observed by Scanning Electron Microscopy (SEM) and also element analysis were carried out by Energy Dispersive X ray (EDX).
Description: Malaysian Technical Universities Conference on Engineering and Technology organized by Universiti Malaysia Pahang in collaboration with Universiti Tun Hussein Onn Malaysia, Universiti Teknikal Malaysia Melaka & Universiti Malaysia Perlis on June 20th - 22nd, 2009, at MS Garden Hotel, Kuantan, Pahang, Malaysia.
URI: http://dspace.unimap.edu.my/123456789/8704
Appears in Collections:Conference Papers

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