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dc.contributor.authorNor Azwin, Ahad-
dc.contributor.authorAw, Yah Yun-
dc.date.accessioned2010-08-16T09:05:09Z-
dc.date.available2010-08-16T09:05:09Z-
dc.date.issued2009-05-20-
dc.identifier.urihttp://dspace.unimap.edu.my/123456789/8704-
dc.descriptionMalaysian Technical Universities Conference on Engineering and Technology organized by Universiti Malaysia Pahang in collaboration with Universiti Tun Hussein Onn Malaysia, Universiti Teknikal Malaysia Melaka & Universiti Malaysia Perlis on June 20th - 22nd, 2009, at MS Garden Hotel, Kuantan, Pahang, Malaysia.en_US
dc.description.abstractThe effects of Al on melting, microstructure and hardness properties of Sn9Zn lead free solders were investigated. SnZnAl solder in this study were produced via melting and casting method. Thermal properties (Tm) of the solder alloys were determined by Differential Scanning Calorimetry (DSC), mechanical properties were investigated by using Vickers Hardness and microstructure were observed by Scanning Electron Microscopy (SEM) and also element analysis were carried out by Energy Dispersive X ray (EDX).en_US
dc.language.isoenen_US
dc.publisherUniversiti Malaysia Pahangen_US
dc.relation.ispartofseriesProceedings of the Malaysian Technical Universities Conference on Engineering and Technology (MUCEET) 2009en_US
dc.subjectLead-free solder alloyen_US
dc.subjectSnZnen_US
dc.subjectAlen_US
dc.subjectMicrostrucutureen_US
dc.subjectThermal propertiesen_US
dc.subjectMalaysian Technical Universities Conference on Engineering and Technology (MUCEET)en_US
dc.titleEffect of small addition of Al to SnZn solder alloysen_US
dc.typeWorking Paperen_US
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