Please use this identifier to cite or link to this item: http://dspace.unimap.edu.my:80/xmlui/handle/123456789/84136
Title: Effect of Potentiodynamic polerization scan rate on the corrosion performance of SN-0.7CU solder in salt solution
Authors: Nuramira Shahira, Asmuni
School of Materials Engineering
Issue Date: Jun-2017
Publisher: Universiti Malaysia Perlis (UniMAP)
Abstract: To investigate corrosion properties of Sn-0.7Cu solders at different scan rate in 3.5 wt% NaCl. To evaluate microstructure, elemental and phase evolution of Sn-0.7Cu solder after NaCl exposure. To study the corrosion mechanism of Sn-0.7Cu solder in 3.5 wt% NaCl.
Description: Access is limited to UniMAP community.
URI: http://dspace.unimap.edu.my:80/xmlui/handle/123456789/84136
Appears in Collections:School of Materials Engineering (FYP)

Files in This Item:
File Description SizeFormat 
Cover title.pdf137.94 kBAdobe PDFView/Open
Introduction.pdf216.25 kBAdobe PDFView/Open
Literature Review.pdf1.29 MBAdobe PDFView/Open
Methodology.pdf348.66 kBAdobe PDFView/Open
Results and Discussion.pdf1.28 MBAdobe PDFView/Open
Conclusions and Recommendations.pdf116.46 kBAdobe PDFView/Open
References.pdf292.65 kBAdobe PDFView/Open


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