Please use this identifier to cite or link to this item:
http://dspace.unimap.edu.my:80/xmlui/handle/123456789/84136
Title: | Effect of Potentiodynamic polerization scan rate on the corrosion performance of SN-0.7CU solder in salt solution |
Authors: | Nuramira Shahira, Asmuni School of Materials Engineering |
Issue Date: | Jun-2017 |
Publisher: | Universiti Malaysia Perlis (UniMAP) |
Abstract: | To investigate corrosion properties of Sn-0.7Cu solders at different scan rate in 3.5 wt% NaCl. To evaluate microstructure, elemental and phase evolution of Sn-0.7Cu solder after NaCl exposure. To study the corrosion mechanism of Sn-0.7Cu solder in 3.5 wt% NaCl. |
Description: | Access is limited to UniMAP community. |
URI: | http://dspace.unimap.edu.my:80/xmlui/handle/123456789/84136 |
Appears in Collections: | School of Materials Engineering (FYP) |
Files in This Item:
File | Description | Size | Format | |
---|---|---|---|---|
Cover title.pdf | 137.94 kB | Adobe PDF | View/Open | |
Introduction.pdf | 216.25 kB | Adobe PDF | View/Open | |
Literature Review.pdf | 1.29 MB | Adobe PDF | View/Open | |
Methodology.pdf | 348.66 kB | Adobe PDF | View/Open | |
Results and Discussion.pdf | 1.28 MB | Adobe PDF | View/Open | |
Conclusions and Recommendations.pdf | 116.46 kB | Adobe PDF | View/Open | |
References.pdf | 292.65 kB | Adobe PDF | View/Open |
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