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Please use this identifier to cite or link to this item: http://dspace.unimap.edu.my:80/xmlui/handle/123456789/84136
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dc.contributor.authorNuramira Shahira, Asmuni-
dc.contributorSchool of Materials Engineeringen_US
dc.date2023-12-
dc.date.accessioned2025-06-05T01:20:42Z-
dc.date.available2025-06-05T01:20:42Z-
dc.date.issued2017-06-
dc.identifier.urihttp://dspace.unimap.edu.my:80/xmlui/handle/123456789/84136-
dc.descriptionAccess is limited to UniMAP community.en_US
dc.description.abstractTo investigate corrosion properties of Sn-0.7Cu solders at different scan rate in 3.5 wt% NaCl. To evaluate microstructure, elemental and phase evolution of Sn-0.7Cu solder after NaCl exposure. To study the corrosion mechanism of Sn-0.7Cu solder in 3.5 wt% NaCl.en_US
dc.language.isoenen_US
dc.publisherUniversiti Malaysia Perlis (UniMAP)en_US
dc.subject.otherMaterial engineeringen_US
dc.subject.otherSolderen_US
dc.subject.otherCorrosionen_US
dc.subject.otherSalt solutionen_US
dc.titleEffect of Potentiodynamic polerization scan rate on the corrosion performance of SN-0.7CU solder in salt solutionen_US
dc.typeLearning Objecten_US
Appears in Collections:School of Materials Engineering (FYP)

Files in This Item:
File Description SizeFormat 
Cover title.pdf137.94 kBAdobe PDFView/Open
Introduction.pdf216.25 kBAdobe PDFView/Open
Literature Review.pdf1.29 MBAdobe PDFView/Open
Methodology.pdf348.66 kBAdobe PDFView/Open
Results and Discussion.pdf1.28 MBAdobe PDFView/Open
Conclusions and Recommendations.pdf116.46 kBAdobe PDFView/Open
References.pdf292.65 kBAdobe PDFView/Open
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