Mask Making Process (Positive and Negative Mask)

Please use this identifier to cite or link to this item: http://dspace.unimap.edu.my:80/xmlui/handle/123456789/8172

Title:	Mask Making Process (Positive and Negative Mask)
Authors:	Uda, Hashim, Prof. Dr. Nur Hamidah, Abdul Halim Mohamad Nuzaihan, Md Nor Zul Azhar, Zahid Jamal, Prof. Dr. uda@unimap.edu.my
Keywords:	Mask E-beam lithography (EBL) EBL System UniMAP -- Research and development UniMAP -- Exhibition PECIPTA 2007
Issue Date:	10-Aug-2007
Publisher:	Kementerian Pengajian Tinggi Malaysia (KPTM)
Series/Report no.:	PECIPTA 2007
Abstract:	Generally, two types of masks are used in MOSFET fabrication; positive mask and negative mask. These resists mask can be used either in lift off process or conventional lithography step depends on the fabrication process requirement. To achieve good resolution, Scanning Electron Microscopy (SEM) based E-beam lithography (EBL) was used to transfer the patern according the design. The patern was design in GDSII Editor in EBL System. Positive resist, Poly-methly-metacrylate (PMMA) and Negative resist, maN2403 were used as a resist in the EBL.
Description:	PECIPTA 2007 dianjurkan oleh Kementerian Pengajian Tinggi Malaysia (KPTM) dengan kerjasama Universiti Sains Malaysia (USM) pada 10 - 12 Ogos 2007 di Pusat Konvensyen Kuala Lumpur (KLCC), Kuala Lumpur.
URI:	http://dspace.unimap.edu.my/123456789/8172
Appears in Collections:	Zul Azhar Zahid Jamal, Dato' Prof. Dr. Universiti Malaysia Perlis Uda Hashim, Prof. Ts. Dr.

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