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Please use this identifier to cite or link to this item: http://dspace.unimap.edu.my:80/xmlui/handle/123456789/7483
Title: Isothermal annealing induced phase Coarsening in Sn-Ag-Cu and Sn-Ag solders
Authors: Norainiza, Saud
Azman, Jalar
intanniza@yahoo.com
Keywords: Sn-rich phase
Sn-Ag-Cu
Sn-Ag
Annealing
Diffusion
Solder pastes
Microelectronics packaging
Microelectronics
Issue Date: 1-Dec-2009
Publisher: Universiti Malaysia Perlis
Citation: p.1-4
Series/Report no.: Proceedings of the Malaysian Metallurgical Conference '09 (MMC'09)
Abstract: The microstructure study of eutectic Sn-Ag-Cu (SAC) and Sn-Ag solders during isothermal annealing has been investigated. Isothermal annealing temperatures were from 60ºC, to 150ºC for 24 up to 1008 hours of anneal time. Infinite Focus Measurement System (IFM®) and Scanning Electron Microscopy- Energy Dispersive Spectrometry (SEM-EDS) are used for microscopy and elemental analysis. Results showed that Sn-rich phases and eutectic phases appear immediately after reflow. However, the diffusion of eutectic component into Sn-rich phases has altered the microstructure and the growth kinetic of the SAC and Sn-Ag solder, as will be discussed further.
Description: Organized by School of Materials Engineering & Sustainable Engineering Research Cluster, 1st - 2nd December 2009 at Putra Brasmana Hotel, Kuala Perlis, Perlis.
URI: http://dspace.unimap.edu.my/123456789/7483
Appears in Collections:Conference Papers
Norainiza Saud, Ts Dr.

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