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dc.contributor.authorNorainiza, Saud-
dc.contributor.authorAzman, Jalar-
dc.date.accessioned2010-01-12T01:48:49Z-
dc.date.available2010-01-12T01:48:49Z-
dc.date.issued2009-12-01-
dc.identifier.citationp.1-4en_US
dc.identifier.urihttp://dspace.unimap.edu.my/123456789/7483-
dc.descriptionOrganized by School of Materials Engineering & Sustainable Engineering Research Cluster, 1st - 2nd December 2009 at Putra Brasmana Hotel, Kuala Perlis, Perlis.en_US
dc.description.abstractThe microstructure study of eutectic Sn-Ag-Cu (SAC) and Sn-Ag solders during isothermal annealing has been investigated. Isothermal annealing temperatures were from 60ºC, to 150ºC for 24 up to 1008 hours of anneal time. Infinite Focus Measurement System (IFM®) and Scanning Electron Microscopy- Energy Dispersive Spectrometry (SEM-EDS) are used for microscopy and elemental analysis. Results showed that Sn-rich phases and eutectic phases appear immediately after reflow. However, the diffusion of eutectic component into Sn-rich phases has altered the microstructure and the growth kinetic of the SAC and Sn-Ag solder, as will be discussed further.en_US
dc.language.isoenen_US
dc.publisherUniversiti Malaysia Perlisen_US
dc.relation.ispartofseriesProceedings of the Malaysian Metallurgical Conference '09 (MMC'09)en_US
dc.subjectSn-rich phaseen_US
dc.subjectSn-Ag-Cuen_US
dc.subjectSn-Agen_US
dc.subjectAnnealingen_US
dc.subjectDiffusionen_US
dc.subjectSolder pastesen_US
dc.subjectMicroelectronics packagingen_US
dc.subjectMicroelectronicsen_US
dc.titleIsothermal annealing induced phase Coarsening in Sn-Ag-Cu and Sn-Ag soldersen_US
dc.typeWorking Paperen_US
dc.contributor.urlintanniza@yahoo.comen_US
Appears in Collections:Conference Papers
Norainiza Saud, Ts Dr.

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