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dc.contributor.authorMd Fazlul, Bari-
dc.contributor.authorNoorzahan, Begum-
dc.contributor.authorShamsul Baharin, Jamaludin-
dc.contributor.authorKamarudin, Hussin-
dc.date.accessioned2010-01-11T06:29:00Z-
dc.date.available2010-01-11T06:29:00Z-
dc.date.issued2009-12-01-
dc.identifier.citationp.1-4en_US
dc.identifier.urihttp://dspace.unimap.edu.my/123456789/7476-
dc.descriptionOrganized by School of Materials Engineering & Sustainable Engineering Research Cluster, 1st - 2nd December 2009 at Putra Brasmana Hotel, Kuala Perlis, Perlis.en_US
dc.description.abstractThis paper reported on the leaching behavior of printed circuit board (PCB) using a new leaching agent of ammonia-ammonium persulfate, to recover copper. Cu and Zn leaching were found to be fast and reached equilibrium in 6h whereas for Ni, prolonged leaching time was needed. The best leaching efficiency was found to be around 99% Cu, 60% Zn and 9% Ni with 5M ammonia, 0.5M ammonium persulfate concentration, which suggested a technological viability of Cu recovery from PCB. Finally the leached solution was subjected for electrowining to recover Cu. The Cu metal with purity of 99.97% was obtained by electrowining.en_US
dc.language.isoenen_US
dc.publisherUniversiti Malaysia Perlisen_US
dc.relation.ispartofseriesProceedings of the Malaysian Metallurgical Conference '09 (MMC'09)en_US
dc.subjectPrinted circuit boarden_US
dc.subjectLeachingen_US
dc.subjectAmmonium persulfateen_US
dc.subjectCopperen_US
dc.subjectMaterials engineeringen_US
dc.titleSelective leaching for the recovery of Copper from PCBen_US
dc.typeWorking Paperen_US
Appears in Collections:Kamarudin Hussin, Brig. Jen. Datuk Prof. Dr.
Conference Papers
Md. Fazlul Bari, Assoc. Prof. Dr.

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