The application of PCB, mountedcComponents and solder paste in surface mount technology assembly (SMTA)

Abstract

Surface Mount Technology or SMT is a rapidly evolving field in the manufacture of electronic components, involving either active (transistors, integrated circuits, diodes, etc) or passive (capacitor, resistors, inductors, coils, etc) which do not have leaded connections. This technique which is SMT, replaces the old technique which the older package tended to use through-hole pins, which pass through holes in a printed circuit board and were soldered from below. The pins contributed inductance, and the size of the holes limits the density of the pins. SMT packages are soldered to the surface of a printed circuit board to alleviate this problem. These techniques are applied to the PCB, mounted components and solder paste. The comparison among the application of PCB, mounted components and solder paste in the SMTA will be shared and compared.