Please use this identifier to cite or link to this item: http://dspace.unimap.edu.my:80/xmlui/handle/123456789/6689
Title: Characterization of robust alignment mark to improve alignment performance
Authors: Normah, Ahmad
Uda, Hashim
Mohd Jefrey, Manaf
Kader, Ibrahim
Keywords: Alignment
Alignment mark
Alignment performance
Alignment signal
Overlay
Integrated circuit technology
Quality control
Issue Date: 2006
Publisher: Institute of Electrical and Electronics Engineering (IEEE)
Citation: p.518-523
Series/Report no.: Proceedings of the IEEE/CPMT International Electronics Manufacturing Technology (IEMT) Symposium
Abstract: Overlay requirement is one of the biggest obstacles in achieving a very small feature. With the continued growth of small feature size, overlay requirement becomes tighter. Such a tight requirement requires a very high performance in alignment. Alignment performance is greatly dependent on alignment signal quality. Variation in metal deposition thickness, polishing time, and mark depth may deteriorate the alignment signals quality. In this paper, different types of alignment mark was used to evaluate the alignment performance in various process environment. Based from the findings, two grating alignment mark gives the worst alignment performance, which clearly indicates the unsuitability to use in production environment.
Description: Link to publisher's homepage at http://ieeexplore.ieee.org
URI: http://ieeexplore.ieee.org/xpls/abs_all.jsp?=&arnumber=4456505
http://dspace.unimap.edu.my/123456789/6689
ISBN: 978-1-4244-0730-9
ISSN: 1089-8190
Appears in Collections:School of Microelectronic Engineering (Articles)
Uda Hashim, Prof. Ts. Dr.

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