Please use this identifier to cite or link to this item: http://dspace.unimap.edu.my:80/xmlui/handle/123456789/6362
Title: Techniques in Integrated Circuit (IC) failure analysis
Authors: Zul Azhar, Zahid Jamal, Assoc. Prof. Dr.
Sanna, Taking
Keywords: Failure analysis
Integrated circuits
Microelectronics
Reliability (Engineering)
Issue Date: 13-Dec-2004
Publisher: ELectron Microscopy Society of Malaysia (EMSM)
Citation: p.1-6
Series/Report no.: 13th Scientific Conference ELectron Microscopy Society of Malaysia (EMSM)
Abstract: Failure analysis (FA) plays an important role in the development and manufacturing of integrated circuits. It provides necessary information for technology advancement and for corrective action to improve quality and reliability. In this paper the commonly used techniques in integrated circuits failure analysis are discussed. The paper also describes the basic FA flow consists of fault localization, deprocessing, defect localisation and inspection characterisation.
Description: Organized by ELectron Microscopy Society of Malaysia (EMSM), 13th - 15th December 2004 at Palm Garden Hotel, Putrajaya.
URI: http://dspace.unimap.edu.my/123456789/6362
Appears in Collections:Conference Papers
Zul Azhar Zahid Jamal, Dato' Prof. Dr.

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