Techniques in Integrated Circuit (IC) failure analysis

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DC Field	Value	Language
dc.contributor.author	Zul Azhar, Zahid Jamal, Assoc. Prof. Dr.	-
dc.contributor.author	Sanna, Taking	-
dc.date.accessioned	2009-07-08T08:36:36Z	-
dc.date.available	2009-07-08T08:36:36Z	-
dc.date.issued	2004-12-13	-
dc.identifier.citation	p.1-6	en_US
dc.identifier.uri	http://dspace.unimap.edu.my/123456789/6362	-
dc.description	Organized by ELectron Microscopy Society of Malaysia (EMSM), 13th - 15th December 2004 at Palm Garden Hotel, Putrajaya.	en_US
dc.description.abstract	Failure analysis (FA) plays an important role in the development and manufacturing of integrated circuits. It provides necessary information for technology advancement and for corrective action to improve quality and reliability. In this paper the commonly used techniques in integrated circuits failure analysis are discussed. The paper also describes the basic FA flow consists of fault localization, deprocessing, defect localisation and inspection characterisation.	en_US
dc.language.iso	en	en_US
dc.publisher	ELectron Microscopy Society of Malaysia (EMSM)	en_US
dc.relation.ispartofseries	13th Scientific Conference ELectron Microscopy Society of Malaysia (EMSM)	en_US
dc.subject	Failure analysis	en_US
dc.subject	Integrated circuits	en_US
dc.subject	Microelectronics	en_US
dc.subject	Reliability (Engineering)	en_US
dc.title	Techniques in Integrated Circuit (IC) failure analysis	en_US
dc.type	Working Paper	en_US
Appears in Collections:	Conference Papers Zul Azhar Zahid Jamal, Dato' Prof. Dr.

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