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http://dspace.unimap.edu.my:80/xmlui/handle/123456789/34482| Title: | The properties of epoxy resin coated silica fillers composites |
| Authors: | Teh, Pei Leng, Dr. Mariatti, Mustapha Hazizan, Md Akil Yeoh, Cheow Keat, Dr. Seetharamu, Kankanhally N. Amir Nur Rashid, Wagiman Beh, Keh Shin tpleng98@yahoo.com mariatti@eng.usm.my hazizan@eng.usm.my yck5@yahoo.com knseetharamu@hotmail.com amir.nur.rashid.wagiman@intel.com keh.shin.beh@intel.com |
| Keywords: | Ceramic filler Electronic packaging Epoxy Polymer |
| Issue Date: | May-2007 |
| Publisher: | Elsevier Ltd. |
| Citation: | Materials Letters, vol. 61(11-12), 2007, pages 2156-2158 |
| Abstract: | Epoxy resin coated silica fillers composites with high percentage of filler loading, such as 80 to 95 vol.% are able to be produced by a mechanical mixing technique. The advantages of high filler loading of theses materials are noted from the thermal and flexural modulus. Apparently, the materials exhibit low coefficient of thermal expansion (CTE) at as low as or below 10 ppm/°C and high flexural modulus of above 20 GPa. In general, these promising characteristics fulfill the requirement to be used as substrate materials in electronic packaging applications. |
| Description: | Link to publisher's homepage at http://www.sciencedirect.com/ |
| URI: | http://www.sciencedirect.com/science/article/pii/S0167577X06010524 http://dspace.unimap.edu.my:80/dspace/handle/123456789/34482 |
| ISSN: | 0167-577X |
| Appears in Collections: | Teh Pei Leng, Associate Professor Dr. Yeoh, Cheow Keat, Assoc. Prof. Ir. Dr. |
Files in This Item:
| File | Description | Size | Format | |
|---|---|---|---|---|
| The properties of epoxy resin coated silica fillers composites.pdf | 56.75 kB | Adobe PDF | View/Open |
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