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dc.contributor.authorTeh, Pei Leng, Dr.-
dc.contributor.authorMariatti, Mustapha-
dc.contributor.authorHazizan, Md Akil-
dc.contributor.authorYeoh, Cheow Keat, Dr.-
dc.contributor.authorSeetharamu, Kankanhally N.-
dc.contributor.authorAmir Nur Rashid, Wagiman-
dc.contributor.authorBeh, Keh Shin-
dc.date.accessioned2014-05-16T08:18:31Z-
dc.date.available2014-05-16T08:18:31Z-
dc.date.issued2007-05-
dc.identifier.citationMaterials Letters, vol. 61(11-12), 2007, pages 2156-2158en_US
dc.identifier.issn0167-577X-
dc.identifier.urihttp://www.sciencedirect.com/science/article/pii/S0167577X06010524-
dc.identifier.urihttp://dspace.unimap.edu.my:80/dspace/handle/123456789/34482-
dc.descriptionLink to publisher's homepage at http://www.sciencedirect.com/en_US
dc.description.abstractEpoxy resin coated silica fillers composites with high percentage of filler loading, such as 80 to 95 vol.% are able to be produced by a mechanical mixing technique. The advantages of high filler loading of theses materials are noted from the thermal and flexural modulus. Apparently, the materials exhibit low coefficient of thermal expansion (CTE) at as low as or below 10 ppm/°C and high flexural modulus of above 20 GPa. In general, these promising characteristics fulfill the requirement to be used as substrate materials in electronic packaging applications.en_US
dc.language.isoenen_US
dc.publisherElsevier Ltd.en_US
dc.subjectCeramic filleren_US
dc.subjectElectronic packagingen_US
dc.subjectEpoxyen_US
dc.subjectPolymeren_US
dc.titleThe properties of epoxy resin coated silica fillers compositesen_US
dc.typeArticleen_US
dc.identifier.urlhttp://dx.doi.org/10.1016/j.matlet.2006.08.036-
dc.contributor.urltpleng98@yahoo.comen_US
dc.contributor.urlmariatti@eng.usm.myen_US
dc.contributor.urlhazizan@eng.usm.myen_US
dc.contributor.urlyck5@yahoo.comen_US
dc.contributor.urlknseetharamu@hotmail.comen_US
dc.contributor.urlamir.nur.rashid.wagiman@intel.comen_US
dc.contributor.urlkeh.shin.beh@intel.comen_US
Appears in Collections:Teh Pei Leng, Associate Professor Dr.
Yeoh, Cheow Keat, Assoc. Prof. Ir. Dr.

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