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Issue DateTitleAuthor(s)
Jul-2013A comparative study of solder properties of Sn-0.7Cu lead-free solder fabricated via the powder metallurgy and casting methodsMohd Arif Anuar, Mohd Salleh; Mohd Mustafa Al Bakri, Abdullah; Sandu, Andrei Victor; Norainiza, Saud; Kamarudin, Hussin, Brig. Jen. Dato' Prof. Dr.; McDonald, Stuart D.; Nogita, Kazuhiro; arifanuar@unimap.edu.my; mustafa_albakri@unimap.edu.my; sav@tuiasi.ro; norainiza@unimap.edu.my; kamarudin@unimap.edu.my; s.mcdonald1@uq.edu.au; k.nogita@uq.edu.au
Oct-2019The effect of Bi on the microstructure, electrical, wettability and mechanical properties of Sn-0.7Cu-0.05Ni alloys for high strength soldering‪Mohd Izrul Izwan, Ramli‬; Mohd Arif Anuar, Mohd Salleh; H., Yasuda; J., Chaiprapa; K., Nogita; mohdizrulizwan@gmail.com; arifanuar@unimap.edu.my; yasuda.hideyuki.6s@kyoto-u.ac.jp; jitrin@slri.or.th; k.nogita@uq.edu.au
Feb-2021Performance of Sn-3.0Ag-0.5Cu composite solder with kaolin geopolymer ceramic reinforcement on microstructure and mechanical properties under isothermal ageingNur Syahirah, Mohamad Zaimi; Mohd Arif Anuar, Mohd Salleh; Sandu, Andrei Victor; Mohd Mustafa Al Bakri, Abdullah; Norainiza, Saud; Shayfull Zamree, Abd Rahim; Vizureanu, Petrica; Rita, Mohd Said; Mohd Izrul, Izwan Ramli; Center of Excellence Geopolymer and Green Technology (CEGeoGTech), School of Materials Engineering, Universiti Malaysia Perlis (UniMAP); Faculty of Chemical Engineering Technology, Universiti Malaysia Perlis (UniMAP); Faculty of Materials Science and Engineering, Gheorghe Asachi Technical University of Iasi; Faculty of Mechanical Engineering Technology, Universiti Malaysia Perlis (UniMAP); arifanuar@unimap.edu.my; sav@tuiasi.ro; peviz@tuiasi.ro

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