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Mohd Arif Anuar Mohd Salleh, Associate Professor Dr. Ir.
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Issue Date
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2014
Mixing optimization of Sn-Cu-Si₃N₄ via powder metallurgy route for composite solder fabrication
Muhammad Hafiz, Zan Hazizi
;
Mohd Arif Anuar, Mohd Salleh
;
Zainal Arifin, Ahmad, Prof.
;
hafizhazizi@unimap.edu.my
;
arifanuar@unimap.edu.my
Dec-2012
Research development of solder materials and its intermetallic compound (IMC) study
Mohd Arif Anuar, Mohd Salleh
;
Najib Saedi, Ibrahim
;
Saud, N.
;
Mohd Mustafa Al Bakri, Abdullah
;
Nik Noriman, Zulkepli
;
Ramani, Mayapan
;
Zainal Ariffin, Ahmad
;
arifanuar@unimap.edu.my
;
najib8789@gmail.com
;
intanniza@yahoo.com
Dec-2012
Research advances of composite solder material fabricated via powder metallurgy route
Mohd Arif Anuar, Mohd Salleh
;
Muhammad Hafiz, Hazizi
;
Mohd Mustafa Al Bakri, Abdullah
;
Nik Noriman, Zulkepli
;
Ramani, Mayapan
;
Zainal Ariffin, Ahmad
;
arifanuar@unimap.edu.my
;
hafizhazizi@unimap.edu.my
2013
The effect of different alkaline treatment condition on flexural properties of kenaf bast- unsaturated polyester composite
Rozyanty, Abdul Rahman
;
Nur Firdaus, M. Y.
;
Mohd Arif Anuar, Mohd Salleh
;
Luqman, Musa, Dr.
;
rozyanty@unimap.edu.my
;
firzad@yahoo.com
;
arifanuar@unimap.edu.my
;
luqman@unimap.edu.my
2013
Effect of aging time towards intermetallic compound (IMC) growth kinetics formation for Sn-0.7Cu-Si3N4 composite solder on copper substrate
Mohd Arif Anuar, Mohd Salleh
;
Noraniza, Saud
;
Najib Saedi, Ibrahim
;
arifanuar@unimap.edu.my
Discover
Author
5
Mohd Arif Anuar, Mohd Salleh
2
Mohd Mustafa Al Bakri, Abdullah
2
Najib Saedi, Ibrahim
2
Nik Noriman, Zulkepli
2
Ramani, Mayapan
.
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Subject
2
Lead-Free solder
2
Powder metallurgy
1
Composite solder
1
Growth kinetics
1
Intermetallic
.
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Date issued
1
2014
2
2013
2
2012