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Please use this identifier to cite or link to this item: http://dspace.unimap.edu.my:80/xmlui/handle/123456789/33694
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dc.contributor.authorVairavan, Rajendaran-
dc.contributor.authorZaliman, Sauli, Dr.-
dc.contributor.authorRetnasamy, Vithyacharan-
dc.contributor.authorKhairul Anwar, Mohamad Khazali-
dc.contributor.authorNooraihan, Abdullah-
dc.contributor.authorNazuhusna, Khalid-
dc.date.accessioned2014-04-14T13:35:28Z-
dc.date.available2014-04-14T13:35:28Z-
dc.date.issued2014-01-
dc.identifier.citationApplied Mechanics and Materials, vol.487, 2014, pages 536-539en_US
dc.identifier.issn1662-7482-
dc.identifier.urihttp://dspace.unimap.edu.my:80/dspace/handle/123456789/33694-
dc.descriptionLink to publisher's homepage at http://www.ttp.net/en_US
dc.description.abstractThis paper presents the characterization of a single chip high power LED package through simulation. Ansys version 11 was used for the simulation. The characterization of the LED package with aluminum cylindrical heat slug was carried out under natural convection condition at ambient temperature of 25°C. The junction temperature and the stress of the LED chip was assesed. The LED chip was powered with input power of 0.1 W and 1 W and the heat dissipation was assesed. Results showed that that the junction temperature and the Von Mises Stress of the single chip LED package increases with the increased input power.en_US
dc.language.isoenen_US
dc.publisherTrans Tech Publicationsen_US
dc.subjectANSYSen_US
dc.subjectCylindrical Al slugen_US
dc.subjectLEDen_US
dc.subjectNatural convectionen_US
dc.titleNatural heat convection analysis on cylindrical Al slug of LEDen_US
dc.typeArticleen_US
dc.identifier.urlhttp://www.scientific.net/AMM.487.536-
dc.identifier.doi10.4028/www.scientific.net/AMM.487.536-
dc.contributor.urlzaliman@unimap.edu.myen_US
Appears in Collections:Nooraihan Abdullah, Dr.
Vithyacharan Retnasamy
Khairul Anwar Mohamad Khazali, Dr.
Zaliman Sauli, Lt. Kol. Professor Dr.
Institute of Engineering Mathematics (Articles)
School of Microelectronic Engineering (Articles)

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