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dc.contributor.authorVairavan, Rajendaran-
dc.contributor.authorZaliman, Sauli, Dr.-
dc.contributor.authorRetnasamy, Vithyacharan-
dc.date.accessioned2014-04-14T13:03:49Z-
dc.date.available2014-04-14T13:03:49Z-
dc.date.issued2014-01-
dc.identifier.citationApplied Mechanics and Materials, vol.487, 2014, pages 145-148en_US
dc.identifier.issn1662-7482-
dc.identifier.urihttp://dspace.unimap.edu.my:80/dspace/handle/123456789/33690-
dc.descriptionLink to publisher's homepage at http://www.ttp.net/en_US
dc.description.abstractHigh power light emitting diodes is the new era of lighting due to momentous supremacy in terms of lighting efficacy over traditional lighting systems. The reliability of LED is dependent on its junction temperature. This study confers on the thermal and stress characterization of LED chip with copper cylindrical heat slug through simulation method. The simulation characterization was carried out with Ansys version 11 at ambient temperature of 25°C under natural convection condition. The LED package was powered with input powers of 0.1 W, 0.5 W and 1W .Results indicated that input power influences the junction temperature and stress of LED chip.en_US
dc.language.isoenen_US
dc.publisherTrans Tech Publicationsen_US
dc.subjectAnsysen_US
dc.subjectCylindrical Cu heat slugen_US
dc.subjectHigh power LEDen_US
dc.subjectJunction temperatureen_US
dc.titleOperating temperature analysis of LED with cylindrical Cu slugen_US
dc.typeArticleen_US
dc.identifier.urlhttp://www.scientific.net/AMM.487.145-
dc.identifier.doi10.4028/www.scientific.net/AMM.487.145-
dc.contributor.urlzaliman @unimap.edu.myen_US
Appears in Collections:Vithyacharan Retnasamy
Zaliman Sauli, Lt. Kol. Professor Dr.
School of Microelectronic Engineering (Articles)

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