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dc.contributor.authorVairavan, Rajendaran-
dc.contributor.authorRetnasamy, Vithyacharan-
dc.contributor.authorZaliman, Sauli, Dr.-
dc.date.accessioned2014-04-13T08:03:29Z-
dc.date.available2014-04-13T08:03:29Z-
dc.date.issued2014-01-
dc.identifier.citationApplied Mechanics and Materials, vol.487, 2014, pages 33-36en_US
dc.identifier.issn1662-7482-
dc.identifier.urihttp://dspace.unimap.edu.my:80/dspace/handle/123456789/33665-
dc.descriptionLink to publisher's homepage at http://www.ttp.net/en_US
dc.description.abstractThe current advancement of LED has prompt thermal challenges from the packaging point of view. The reliability of the LED is significantly influenced by each of its packaging component. This paper presents the investigation of heat slug size effect on the junction temperature and stress of single chip LED through simulation method. Ansys version 11 was utilized and the analysis was done with copper diamond rectangular heat slug under natural convection condition at ambient temperature of 25 °C.The simulation results indicated that junction temperature and the stress of the single chip LED is influenced by the size of heat slug.en_US
dc.language.isoenen_US
dc.publisherTrans Tech Publicationsen_US
dc.subjectAnsysen_US
dc.subjectCuDia heat slugen_US
dc.subjectHigh power LEDen_US
dc.subjectJunction temperatureen_US
dc.titleCuDia slug size variation analysis on heat dissipation of high power LEDen_US
dc.typeArticleen_US
dc.identifier.urlhttp://www.scientific.net/AMM.487.33-
dc.identifier.doi10.4028/www.scientific.net/AMM.487.33-
dc.contributor.urlvc.sundress@gmail.comen_US
Appears in Collections:Vithyacharan Retnasamy
Zaliman Sauli, Lt. Kol. Professor Dr.
School of Microelectronic Engineering (Articles)

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