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Please use this identifier to cite or link to this item: http://dspace.unimap.edu.my:80/xmlui/handle/123456789/32463
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dc.contributor.authorFlora Somidin
dc.contributor.authorMohd Arif Anuar, Mohd Salleh
dc.contributor.authorKhairel Rafezi, Ahmad, Dr.
dc.date.accessioned2014-03-09T09:53:26Z
dc.date.available2014-03-09T09:53:26Z
dc.date.issued2012-12
dc.identifier.citationAdvanced Materials Research, vol.620, 2012, pages 105-111en_US
dc.identifier.issn1662-8985
dc.identifier.urihttp://dspace.unimap.edu.my:80/dspace/handle/123456789/32463
dc.descriptionLink to publisher's homepage at http://www.scientific.net/en_US
dc.description.abstractFeasibility of using recycled-Aluminum (re-Al) as reinforcement particulates in Sn-0.7Cu is assessed by powder technology method, whereby re-Al particulates are produced from discarded aluminum beverage cans. This paper focuses on the intermetallic compound (IMC) formation study between the fabricated solder composite on Cu-substrate. Throughout this study, four different composition of Sn-0.7Cu/re-Al (0.0, 3.0, 3.5, 4.0 wt.%) were studied. X-ray diffraction (XRD) was used to analyze the IMCs phase formation between the interfaces. New IMC phase of Cu9Al4 was detected beside Cu6Sn5 and Cu3Sn in the composite solder samples. However, Sn-0.7Cu/3.0re-Al showed least formation of brittle IMCs compared to the monolithic solder.en_US
dc.language.isoenen_US
dc.publisherScientific.Neten_US
dc.subjectComposite solderen_US
dc.subjectIntermetallic compounden_US
dc.subjectPowder metallurgyen_US
dc.subjectRecycle-aluminumen_US
dc.subjectSn-0.7Cuen_US
dc.titleIntermetallic compound formation on solder alloy/cu-substrate interface using lead-free sn-0.7cu/recycled-aluminum composite solderen_US
dc.typeArticleen_US
dc.identifier.urlhttp://www.scientific.net/AMR.620.105
dc.contributor.urlflorasom@gmail.comen_US
dc.contributor.urlarifanuar@unimap.edu.myen_US
dc.contributor.urlrafezi@unimap.edu.myen_US
Appears in Collections:Mohd Arif Anuar Mohd Salleh, Associate Professor Dr. Ir.
Khairel Rafezi Ahmad, Associate Prof Dr.
School of Materials Engineering (Articles)

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