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Statistics
Total Visits
| Views | |
|---|---|
| Intermetallic compound formation on solder alloy/cu-substrate interface using lead-free sn-0.7cu/recycled-aluminum composite solder | 228 |
Total Visits per Month
| November 2024 | December 2024 | January 2025 | February 2025 | March 2025 | April 2025 | May 2025 | |
|---|---|---|---|---|---|---|---|
| Intermetallic compound formation on solder alloy/cu-substrate interface using lead-free sn-0.7cu/recycled-aluminum composite solder | 8 | 18 | 23 | 7 | 10 | 8 | 3 |
File Downloads
| Views | |
|---|---|
| Intermetallic Compound Formation on Solder Alloy.pdf | 58 |
Top Country Views
| Views | |
|---|---|
| United States | 114 |
| China | 20 |
| Germany | 11 |
| Ireland | 10 |
| Russia | 9 |
| Finland | 8 |
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| Senegal | 6 |
| Togo | 6 |
| Brazil | 4 |
Top City Views
| Views | |
|---|---|
| Ashburn | 39 |
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| Dublin | 10 |
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