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Statistics
Total Visits
| Views | |
|---|---|
| Intermetallic compound formation on solder alloy/cu-substrate interface using lead-free sn-0.7cu/recycled-aluminum composite solder | 217 |
Total Visits per Month
| October 2024 | November 2024 | December 2024 | January 2025 | February 2025 | March 2025 | April 2025 | |
|---|---|---|---|---|---|---|---|
| Intermetallic compound formation on solder alloy/cu-substrate interface using lead-free sn-0.7cu/recycled-aluminum composite solder | 8 | 8 | 18 | 23 | 7 | 10 | 0 |
File Downloads
| Views | |
|---|---|
| Intermetallic Compound Formation on Solder Alloy.pdf | 57 |
Top Country Views
| Views | |
|---|---|
| United States | 108 |
| China | 20 |
| Germany | 11 |
| Ireland | 10 |
| Russia | 9 |
| Finland | 8 |
| Sweden | 7 |
| Senegal | 6 |
| Togo | 6 |
| Canada | 4 |
Top City Views
| Views | |
|---|---|
| Ashburn | 33 |
| San Mateo | 19 |
| Dublin | 10 |
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