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http://dspace.unimap.edu.my:80/xmlui/handle/123456789/27113| Title: | Green underfill - a novel green polymer hybrid as underfill material in electronic packaging application |
| Authors: | Aida Fakhrul, Lamakasauk Nurul Shakina, Surani Mohd Arif Anuar, Mohd Salleh Nik Noriman, Zulkepli, Dr. Mohd Mustafa Al-Bakri, Abdullah Rosniza, Hamzah Mohamad, Abu Bakar arifanuar@unimap.edu.my |
| Keywords: | Underfill material Epoxy polymer Epoxidized natural rubber Polymer hybrid |
| Issue Date: | 29-Jun-2012 |
| Publisher: | Macao Innovation & Invention Association |
| Series/Report no.: | Macau International Innovation & Invention Expo (IIEX) 2012 |
| Abstract: | Underfill is a material used to provide a stronger mechanical connection, provide heat bridge and to ensure the soldier joint are not stressed out due to differential heating on the chip and the rest of system. |
| Description: | The team has won gold medal and Korea University Invention Association (KUIA) Special Award at Macau International Innovation & Invention Expo 2012, 29th June - 1st July 2012 was held at Macau Fisherman Wharf Exhibition Centre Macau, China. |
| URI: | http://dspace.unimap.edu.my/123456789/27113 |
| Appears in Collections: | Universiti Malaysia Perlis Nik Noriman Zulkepli, Assoc. Prof. Ts. Dr. |
Files in This Item:
| File | Description | Size | Format | |
|---|---|---|---|---|
| GREEN UNDERFILLGOLD MEDAL.jpg | Access is limited to UniMAP community | 1.44 MB | JPEG | View/Open |
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