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Please use this identifier to cite or link to this item: http://dspace.unimap.edu.my:80/xmlui/handle/123456789/27113
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dc.contributor.authorAida Fakhrul, Lamakasauk-
dc.contributor.authorNurul Shakina, Surani-
dc.contributor.authorMohd Arif Anuar, Mohd Salleh-
dc.contributor.authorNik Noriman, Zulkepli, Dr.-
dc.contributor.authorMohd Mustafa Al-Bakri, Abdullah-
dc.contributor.authorRosniza, Hamzah-
dc.contributor.authorMohamad, Abu Bakar-
dc.date.accessioned2013-07-25T05:32:05Z-
dc.date.available2013-07-25T05:32:05Z-
dc.date.issued2012-06-29-
dc.identifier.urihttp://dspace.unimap.edu.my/123456789/27113-
dc.descriptionThe team has won gold medal and Korea University Invention Association (KUIA) Special Award at Macau International Innovation & Invention Expo 2012, 29th June - 1st July 2012 was held at Macau Fisherman Wharf Exhibition Centre Macau, China.en_US
dc.description.abstractUnderfill is a material used to provide a stronger mechanical connection, provide heat bridge and to ensure the soldier joint are not stressed out due to differential heating on the chip and the rest of system.en_US
dc.language.isoenen_US
dc.publisherMacao Innovation & Invention Associationen_US
dc.relation.ispartofseriesMacau International Innovation & Invention Expo (IIEX) 2012en_US
dc.subjectUnderfill materialen_US
dc.subjectEpoxy polymeren_US
dc.subjectEpoxidized natural rubberen_US
dc.subjectPolymer hybriden_US
dc.titleGreen underfill - a novel green polymer hybrid as underfill material in electronic packaging applicationen_US
dc.typeOtheren_US
dc.contributor.urlarifanuar@unimap.edu.myen_US
Appears in Collections:Universiti Malaysia Perlis
Nik Noriman Zulkepli, Assoc. Prof. Ts. Dr.

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