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Issue Date
Title
Author(s)
Sep-2012
Surfactant-free synthesis of copper particles for electrically conductive adhesive applications
Ho, Li Ngee
;
Nishikawa, Hiroshi
;
holingee@yahoo.com
Aug-2010
Electrical properties of pre-alloyed Cu-P containing electrically conductive adhesive
Ho, Li Ngee
;
Tang, Fei Wu
;
Nishikawa, Hiroshi
;
Takemoto, Tadashi
2011
Electrical reliability of different alloying content on copper alloy fillers in electrically conductive adhesives
Lin-Ngee, Ho
;
Teng, Fei Wu
;
Nishikawa, Hiroshi
;
Takemoto, Tadashi
;
Miyake, Koichi
;
Fujita, Masakazu
;
Ota, Koyu
;
holingee@yahoo.com
May-2011
Effect of different copper fillers on the electrical resistivity of conductive adhesives
Li-Ngee, Ho
;
Nishikawa, Hiroshi
;
Takemoto, Tadashi
;
holingee@yahoo.com
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Author
3
Takemoto, Tadashi
2
Ho, Li Ngee
1
Fujita, Masakazu
1
Li-Ngee, Ho
1
Lin-Ngee, Ho
.
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Subject
2
Conductive adhesive
2
Electrical resistivity
1
Aging
1
Copper
1
Copper alloy filler
.
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Date issued
1
2012
2
2011
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2010