Please use this identifier to cite or link to this item: http://dspace.unimap.edu.my:80/xmlui/handle/123456789/20231
Title: Methods of measurement of LTCC metallization thickness
Authors: Khiang, Lee Soo
Norhawati, Ahmad
Muammar, Mohamad Isa
Rosidah, Alias
norhawati@unimap.edu.my
muammar@unimap.edu.my
Keywords: Conductive pastes
Conductor pastes
Cost effectives
Electrical resistances
LTCC (low temperature co fired ceramic)
LTCC substrates
Metallization
Issue Date: 1-Dec-2008
Publisher: Institute of Electrical and Electronics Engineers (IEEE)
Citation: p. 1-7
Series/Report no.: Proceedings of the International Conference on Electronic Design (ICED) 2008
Abstract: Metallization provides electrical routing and serves as thermal via in LTCC (Low Temperature Cofired Ceramic) technology. High electrical and thermal conductivity is desirable. It is often achieved with the use of low electrical resistance materials, such as gold, silver and copper. The conductive paste made of these materials is expensive. Hence, the fabrication of LTCC has to be performance-wise and cost effective. The width, length and thickness of metallization are associated with the amount of conductor paste used. The thickness of metallization governs the functionality and performance of some components, such as resistor. In this paper, the physical attributes of LTCC substrate and its metallization was studied. Due to the constraint brought by the physical attributes of LTCC samples, various methods had been carried out. This paper also summarized the pros and cons of each method. The methods are limited to the equipment available.
Description: Link to publisher's homepage at http://ieeexplore.ieee.org/
URI: http://ieeexplore.ieee.org/xpl/articleDetails.jsp?arnumber=4786684
http://dspace.unimap.edu.my/123456789/20231
ISBN: 978-142442315-6
Appears in Collections:Conference Papers

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