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DC Field | Value | Language |
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dc.contributor.author | Khiang, Lee Soo | - |
dc.contributor.author | Norhawati, Ahmad | - |
dc.contributor.author | Muammar, Mohamad Isa | - |
dc.contributor.author | Rosidah, Alias | - |
dc.date.accessioned | 2012-07-09T09:21:42Z | - |
dc.date.available | 2012-07-09T09:21:42Z | - |
dc.date.issued | 2008-12-01 | - |
dc.identifier.citation | p. 1-7 | en_US |
dc.identifier.isbn | 978-142442315-6 | - |
dc.identifier.uri | http://ieeexplore.ieee.org/xpl/articleDetails.jsp?arnumber=4786684 | - |
dc.identifier.uri | http://dspace.unimap.edu.my/123456789/20231 | - |
dc.description | Link to publisher's homepage at http://ieeexplore.ieee.org/ | en_US |
dc.description.abstract | Metallization provides electrical routing and serves as thermal via in LTCC (Low Temperature Cofired Ceramic) technology. High electrical and thermal conductivity is desirable. It is often achieved with the use of low electrical resistance materials, such as gold, silver and copper. The conductive paste made of these materials is expensive. Hence, the fabrication of LTCC has to be performance-wise and cost effective. The width, length and thickness of metallization are associated with the amount of conductor paste used. The thickness of metallization governs the functionality and performance of some components, such as resistor. In this paper, the physical attributes of LTCC substrate and its metallization was studied. Due to the constraint brought by the physical attributes of LTCC samples, various methods had been carried out. This paper also summarized the pros and cons of each method. The methods are limited to the equipment available. | en_US |
dc.language.iso | en | en_US |
dc.publisher | Institute of Electrical and Electronics Engineers (IEEE) | en_US |
dc.relation.ispartofseries | Proceedings of the International Conference on Electronic Design (ICED) 2008 | en_US |
dc.subject | Conductive pastes | en_US |
dc.subject | Conductor pastes | en_US |
dc.subject | Cost effectives | en_US |
dc.subject | Electrical resistances | en_US |
dc.subject | LTCC (low temperature co fired ceramic) | en_US |
dc.subject | LTCC substrates | en_US |
dc.subject | Metallization | en_US |
dc.title | Methods of measurement of LTCC metallization thickness | en_US |
dc.type | Working Paper | en_US |
dc.contributor.url | norhawati@unimap.edu.my | en_US |
dc.contributor.url | muammar@unimap.edu.my | en_US |
Appears in Collections: | Conference Papers |
Files in This Item:
File | Description | Size | Format | |
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Methods of measurement of LTCC metallization thickness.pdf | 18.92 kB | Adobe PDF | View/Open |
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