UniMAP Library Digital Repository JSPUI
UniMAP Library Digital Repository preserves and enables easy and open access to all types of digital content including text, images, moving images, mpegs and data sets
Learn More
Browsing by Author mohdizrulizwan@gmail.com
Showing results 1 to 3 of 3
Issue Date | Title | Author(s) |
Oct-2019 | The effect of Bi on the microstructure, electrical, wettability and mechanical properties of Sn-0.7Cu-0.05Ni alloys for high strength soldering | Mohd Izrul Izwan, Ramli; Mohd Arif Anuar, Mohd Salleh; H., Yasuda; J., Chaiprapa; K., Nogita; mohdizrulizwan@gmail.com; arifanuar@unimap.edu.my; yasuda.hideyuki.6s@kyoto-u.ac.jp; jitrin@slri.or.th; k.nogita@uq.edu.au |
Oct-2016 | Influence of Activated Carbon Particles on Intermetallic Compound Growth Mechanism in Sn-Cu-Ni Composite Solder | Mohd Izrul Izwan, Ramli; Mohd Arif Anuar, Mohd Salleh; Mohd Nazree, Derman; Rita, Mohd Said; Norainiza, Saud; mohdizrulizwan@gmail.com |
Jul-2016 | Isothermal aging affect to the growth of Sn-Cu-Ni-1 wt. % TiO2 composite solder paste | Rita, Mohd Said; Mohd Arif Anuar, Mohd Salleh; Mohd Nazree, Derman; Mohd Izrul, Izwan Ramli; Norhayanti, Mohd Nasir; Norainiza, Saud; ritamohdsaid15@gmail.com; arifanuar@unimap.edu.my; nazreederman@gmail.com; mohdizrulizwan@gmail.com; hayantinet@gmail.com; norainiza@unimap.edu.my |