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Issue DateTitleAuthor(s)
2003Fast transient solutions for heat transfer [FEM]Ooi, Chen Hee; Seetharamu, Kankanhally N.; Zainal Alimuddin, Zainal Alauddin, Dr.; Ghulam, Abdul Quadir, Prof. Dr.; Sim, K. S.; Goh, Teck Joo; knseetharamu@hotmail.com; gaquadir@unimap.edu.my
2004FEM analysis of multifluid heat exchangersSeetharamu, Kankanhally N.; Quadir, Abdul Quadir, Prof. Dr.; Zainal Alimuddin, Zainal Alauddin, Dr.; Krishnan, Ganapathi M.; knseetharamu@hotmail.com; gaquadir@unimap.edu.my
2001Finite element modelling of solidification phenomenaSeetharamu, Kankanhally N.; Paragasam, R.; Quadir, Abdul Quadir, Prof. Dr.; Zainal Alimuddin, Zainal Alauddin, Dr.; Prasad, B. S.; Sundararajan, Thirumalachari; knseetharamu@hotmail.com; gaquadir@unimap.edu.my
2003Flip chip thermal test vehicle design: Requirements, evaluations, and validationsGoh, Teck Joo; Chu, Chia Pin; Seetharamu, Kankanhally N.; Ghulam, Abdul Quadir, Prof. Dr.; Zainal Alimuddin, Zainal Alauddin, Dr.; knseetharamu@hotmail.com; gaquadir@unimap.edu.my
2004Flow analysis for flip chip underfilling process using characteristic based split methodKulkarni, Venkatesh M.; Seetharamu, Kankanhally N.; Aswatha Narayana, P. A.; Ishak, Abdul Azid, Dr.; Ghulam, Abdul Quadir, Prof. Dr.; knseetharamu@hotmail.com; ishak@eng.usm.my; gaquadir@unimap.edu.my
2002Modeling of wire-on-tube heat exchangers using finite element methodGhulam, Abdul Quadir, Prof. Dr.; Krishnan, Ganapathi M.; Seetharamu, Kankanhally N.; gaquadir@unimap.edu.my; knseetharamu@hotmail.com
2002Numerical and experimental heat transfer studies on totally enclosed fan ventilated machinesRajagopal, M. S.; Aswatha Narayana, P. A.; Ghulam, Abdul Quadir, Prof. Dr.; Seetharamu, Kankanhally N.; gaquadir@unimap.edu.my; knseetharamu@hotmail.com
2006Numerical simulation of underfill encapsulation process based on characteritsic split methodKulkarni, Venkatesh M.; Seetharamu, Kankanhally N.; Ishak, Abdul Azid, Dr.; Aswatha Narayana, P. A.; Ghulam, Abdul Quadir, Prof. Dr.; vmkulkarni1@yahoo.com; knseetharamu@hotmail.com; ishak@eng.usm.my; paa_iitm@yahoo.co.in; gaquadir@unimap.edu.my
2005Optimization of fins used in electronic packagingOng, Kang Eu; Lee, Kor Oon; Seetharamu, Kankanhally N.; Ishak, Abdul Azid, Dr.; Ghulam, Abdul Quadir, Prof. Dr.; Zainal Alimuddin, Zainal Alauddin, Dr.; Goh, Teck Joo; leekoroon@yahoo.com; knseetharamu@hotmail.com; ishak@eng.usm.my; gaquadir@unimap.edu.my
2002Optimization of PCB component placement using genetic algorithmJeevan, Kanesan; Parthiban, A.; Seetharamu, Kankanhally N.; Ishak, Abdul Azid, Dr.; Ghulam, Abdul Quadir, Prof. Dr.; knseetharamu@hotmail.com; ishak@eng.usm.my; gaquadir@unimap.edu.my
2005Optimization of thermal resistance of stacked micro-channel using genetic algorithmsJeevan, Kanesan; Ghulam, Quadir, Prof. Dr.; Seetharamu, Kankanhally N.; Ishak, Abdul Azid, Dr.; Zainal Alimuddin, Zainal Alauddin, Dr.; gaquadir@unimap.edu.my; knseetharamu@hotmail.com; ishak@eng.usm.my
2000Performance of wire-on-tube heat exchangers used in immersion cooling for electronic packagesGhulam, Abdul Quadir, Prof. Dr.; Leong, C.B.; Krishnan, G.M.; Seetharamu, Kankanhally N.; gaquadir@unimap.edu.my; knseetharamu@hotmail.com
2004Prediction of temperature in silicon chip with non-uniform power: a Lagrangian interpolation approachGoh, Teck Joo; Seetharamu, Kankanhally N.; Ghulam, Abdul Quadir, Prof. Dr.; Zainal Alimuddin, Zainal Alauddin, Dr.; Jeevan, Kanesan; knseetharamu@hotmail.com; gaquadir@unimap.edu.my
May-2007The properties of epoxy resin coated silica fillers compositesTeh, Pei Leng, Dr.; Mariatti, Mustapha; Hazizan, Md Akil; Yeoh, Cheow Keat, Dr.; Seetharamu, Kankanhally N.; Amir Nur Rashid, Wagiman; Beh, Keh Shin; tpleng98@yahoo.com; mariatti@eng.usm.my; hazizan@eng.usm.my; yck5@yahoo.com; knseetharamu@hotmail.com; amir.nur.rashid.wagiman@intel.com; keh.shin.beh@intel.com
2005Steady and unsteady thermal analysis of a triple stack cold plate with heat lossesBeh, Shiao Lin; Ooi, Chen Hee; Ghulam, Abdul Quadir, Prof. Dr.; Seetharamu, Kankanhally N.; gaquadir@unimap.edu.my; knseetharamu@hotmail.com
2003Steady state finite element analysis of a double stack cold plate with heat lossesGhulam, Abdul Quadir, Prof. Dr.; Beh, Shiao Lin; Seetharamu, Kankanhally N.; Ahmad Yusoff, Hassan; gaquadir@unimap.edu.my; knseetharamu@hotmail.com
2006Test chip and substrate design for flip chip microelectronic package thermal measurementsGoh, Teck Joo; Chiu, Chiapin; Seetharamu, Kankanhally N.; Ghulam, Abdul Quadir, Prof. Dr.; Zainal Alimuddin, Zainal Alauddin, Dr.; teck.joo.goh@intel.com; knseetharamu@hotmail.com; gaquadir@unimap.edu.my
2005Thermal analysis of micro-channel heat exchangers with two-phase flow using FEMHegde., Pradeep G.; Seetharamu, Kankanhally N.; Ghulam, Abdul Quadir, Prof. Dr.; Aswatha Narayana, P. A.; Mohd Zulkifly, Abdullah; Zainal Alimuddin, Zainal Alauddin, Dr.; knseetharamu@hotmail.com; gaquadir@unimap.edu.my
2004Thermal investigations of microelectronic chip with non-uniform power distribution: temperature prediction and thermal placement design optimizationGoh, Teck Joo; Seetharamu, Kankanhally N.; Ghulam, Abdul Quadir, Prof. Dr.; Zainal Alimuddin, Zainal Alauddin, Dr.; Ganeshamoorthy, K. Jeevan; teck.joo.goh@intel.com; knseetharamu@hotmail.com; gaquadir@unimap.edu.my
2005Thermal management of multi-chip module and printed circuit board using FEM and genetic algorithmsJeevan, Kanesan; Ghulam, Abdul Quadir, Prof. Dr.; Seetharamu, Kankanhally N.; Ishak, Abdul Azid, Dr.; gaquadir@unimap.edu.my; knseetharamu@hotmail.com; ishak@eng.usm.my
Showing results 1 to 20 of 22  next >