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Issue DateTitleAuthor(s)
Jul-2013A comparative study of solder properties of Sn-0.7Cu lead-free solder fabricated via the powder metallurgy and casting methodsMohd Arif Anuar, Mohd Salleh; Mohd Mustafa Al Bakri, Abdullah; Sandu, Andrei Victor; Norainiza, Saud; Kamarudin, Hussin, Brig. Jen. Dato' Prof. Dr.; McDonald, Stuart D.; Nogita, Kazuhiro; arifanuar@unimap.edu.my; mustafa_albakri@unimap.edu.my; sav@tuiasi.ro; norainiza@unimap.edu.my; kamarudin@unimap.edu.my; s.mcdonald1@uq.edu.au; k.nogita@uq.edu.au
Oct-2019The effect of Bi on the microstructure, electrical, wettability and mechanical properties of Sn-0.7Cu-0.05Ni alloys for high strength soldering‪Mohd Izrul Izwan, Ramli‬; Mohd Arif Anuar, Mohd Salleh; H., Yasuda; J., Chaiprapa; K., Nogita; mohdizrulizwan@gmail.com; arifanuar@unimap.edu.my; yasuda.hideyuki.6s@kyoto-u.ac.jp; jitrin@slri.or.th; k.nogita@uq.edu.au
2013Non-metal reinforced lead-free composite solder fabrication methods and its reinforcing effects to the suppression of intermetallic formation: short reviewMohd Arif Anuar, Mohd Salleh; McDonald, Stuart D.; Nogita, Kazuhiro; k.nogita@uq.edu.au; s.mcdonald@uq.edu.au; arifanuar@unimap.edu.my
Showing results 1 to 3 of 3