1. UniMAP Library Digital Repository

Browsing by Author Nishikawa, Hiroshi

Jump to: 0-9 A B C D E F G H I J K L M N O P Q R S T U V W X Y Z
or enter first few letters:  
Showing results 1 to 4 of 4
Issue DateTitleAuthor(s)
May-2011Effect of different copper fillers on the electrical resistivity of conductive adhesivesLi-Ngee, Ho; Nishikawa, Hiroshi; Takemoto, Tadashi; holingee@yahoo.com
Aug-2010Electrical properties of pre-alloyed Cu-P containing electrically conductive adhesiveHo, Li Ngee; Tang, Fei Wu; Nishikawa, Hiroshi; Takemoto, Tadashi
2011Electrical reliability of different alloying content on copper alloy fillers in electrically conductive adhesivesLin-Ngee, Ho; Teng, Fei Wu; Nishikawa, Hiroshi; Takemoto, Tadashi; Miyake, Koichi; Fujita, Masakazu; Ota, Koyu; holingee@yahoo.com
Sep-2012Surfactant-free synthesis of copper particles for electrically conductive adhesive applicationsHo, Li Ngee; Nishikawa, Hiroshi; holingee@yahoo.com
Showing results 1 to 4 of 4