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Showing results 2 to 3 of 3
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Issue Date
Title
Author(s)
2014
Low and high temperature isothermal aging effect on morphology and diffusion kinetics of intermetallic compound (IMC) for Sn-Cu-Si āNā composite solder
Norainiza, Saud
;
Najib Saedi, Ibrahim
;
Mohd Arif Anuar, Mohd Salleh
;
norainiza@unimap.edu.my
;
najib8789@gmail.com
;
arifanuar@unimap.edu.my
Dec-2012
Research development of solder materials and its intermetallic compound (IMC) study
Mohd Arif Anuar, Mohd Salleh
;
Najib Saedi, Ibrahim
;
Saud, N.
;
Mohd Mustafa Al Bakri, Abdullah
;
Nik Noriman, Zulkepli
;
Ramani, Mayapan
;
Zainal Ariffin, Ahmad
;
arifanuar@unimap.edu.my
;
najib8789@gmail.com
;
intanniza@yahoo.com