| dc.contributor.author | Nor Azwin, Ahad | |
| dc.contributor.author | Aw, Yah Yun | |
| dc.date.accessioned | 2010-08-16T09:05:09Z | |
| dc.date.available | 2010-08-16T09:05:09Z | |
| dc.date.issued | 2009-05-20 | |
| dc.identifier.uri | http://dspace.unimap.edu.my/123456789/8704 | |
| dc.description | Malaysian Technical Universities Conference on Engineering and Technology organized by Universiti Malaysia Pahang in collaboration with Universiti Tun Hussein Onn Malaysia, Universiti Teknikal Malaysia Melaka & Universiti Malaysia Perlis on
June 20th - 22nd, 2009, at MS Garden Hotel, Kuantan, Pahang, Malaysia. | en_US |
| dc.description.abstract | The effects of Al on melting,
microstructure and hardness properties
of Sn9Zn lead free solders were
investigated. SnZnAl solder in this study
were produced via melting and casting
method. Thermal properties (Tm) of the
solder alloys were determined by
Differential Scanning Calorimetry
(DSC), mechanical properties were
investigated by using Vickers Hardness
and microstructure were observed by
Scanning Electron Microscopy (SEM)
and also element analysis were carried
out by Energy Dispersive X ray (EDX). | en_US |
| dc.language.iso | en | en_US |
| dc.publisher | Universiti Malaysia Pahang | en_US |
| dc.relation.ispartofseries | Proceedings of the Malaysian Technical Universities Conference on Engineering and Technology (MUCEET) 2009 | en_US |
| dc.subject | Lead-free solder alloy | en_US |
| dc.subject | SnZn | en_US |
| dc.subject | Al | en_US |
| dc.subject | Microstrucuture | en_US |
| dc.subject | Thermal properties | en_US |
| dc.subject | Malaysian Technical Universities Conference on Engineering and Technology (MUCEET) | en_US |
| dc.title | Effect of small addition of Al to SnZn solder alloys | en_US |
| dc.type | Working Paper | en_US |
