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dc.contributor.authorLi-Ngee, Ho
dc.contributor.authorHiroshi, Nishikawa
dc.contributor.authorTadashi, Takemoto
dc.date.accessioned2010-01-20T03:41:10Z
dc.date.available2010-01-20T03:41:10Z
dc.date.issued2009-12-01
dc.identifier.citationp.1-4en_US
dc.identifier.urihttp://dspace.unimap.edu.my/123456789/7530
dc.descriptionOrganized by School of Materials Engineering & Sustainable Engineering Research Cluster, 1st - 2nd December 2009 at Putra Brasmana Hotel, Kuala Perlis, Perlis.en_US
dc.description.abstractElectrically conductive adhesives (ECA) containing Cu-P and Cu as metallic filler, respectively, were studied in term of electrical properties and thermal stability. Both metallic fillers used in this study were prepared by using gas atomization method. The electrical property of the Cu-P filled ECA was investigated for long-term stability and reliability by aging at high temperature exposure at 125°C for 1000 h. Results showed that the Cu-P filled ECA remained consistently low electrical resistivity after 1000 h aging at 125°C, compared to that of the Cu filled ECA where the electrical resistivity increased rapidly over time.en_US
dc.language.isoenen_US
dc.publisherUniversiti Malaysia Perlisen_US
dc.relation.ispartofseriesProceedings of the Malaysian Metallurgical Conference '09 (MMC'09)en_US
dc.subjectConductive adhesiveen_US
dc.subjectCopperen_US
dc.subjectAgingen_US
dc.subjectElectrical propertiesen_US
dc.subjectMetallic fillersen_US
dc.subjectSoldersen_US
dc.titleElectrical properties and thermal stability of Cu-P containing electrically conductive adhesivesen_US
dc.typeWorking Paperen_US
dc.contributor.urlholingee@yahoo.comen_US


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