| dc.contributor.author | Norainiza, Saud | |
| dc.contributor.author | Azman, Jalar | |
| dc.date.accessioned | 2010-01-12T01:48:49Z | |
| dc.date.available | 2010-01-12T01:48:49Z | |
| dc.date.issued | 2009-12-01 | |
| dc.identifier.citation | p.1-4 | en_US |
| dc.identifier.uri | http://dspace.unimap.edu.my/123456789/7483 | |
| dc.description | Organized by School of Materials Engineering & Sustainable Engineering Research Cluster, 1st - 2nd December 2009 at Putra Brasmana Hotel, Kuala Perlis, Perlis. | en_US |
| dc.description.abstract | The microstructure study of eutectic Sn-Ag-Cu (SAC) and Sn-Ag solders during isothermal annealing has been investigated. Isothermal annealing temperatures were from 60ºC, to 150ºC for 24 up to 1008 hours of anneal time. Infinite Focus Measurement System (IFM®) and Scanning Electron Microscopy- Energy Dispersive Spectrometry (SEM-EDS) are used for microscopy and elemental analysis. Results showed that Sn-rich phases and eutectic phases appear immediately after reflow. However, the diffusion of eutectic component into Sn-rich phases has altered the microstructure and the growth kinetic of the SAC and Sn-Ag solder, as will be discussed further. | en_US |
| dc.language.iso | en | en_US |
| dc.publisher | Universiti Malaysia Perlis | en_US |
| dc.relation.ispartofseries | Proceedings of the Malaysian Metallurgical Conference '09 (MMC'09) | en_US |
| dc.subject | Sn-rich phase | en_US |
| dc.subject | Sn-Ag-Cu | en_US |
| dc.subject | Sn-Ag | en_US |
| dc.subject | Annealing | en_US |
| dc.subject | Diffusion | en_US |
| dc.subject | Solder pastes | en_US |
| dc.subject | Microelectronics packaging | en_US |
| dc.subject | Microelectronics | en_US |
| dc.title | Isothermal annealing induced phase Coarsening in Sn-Ag-Cu and Sn-Ag solders | en_US |
| dc.type | Working Paper | en_US |
| dc.contributor.url | intanniza@yahoo.com | en_US |
