Show simple item record

dc.contributor.authorMohsen, Mojiri
dc.contributor.authorMohsen, Jabbari
dc.date.accessioned2009-11-04T08:42:53Z
dc.date.available2009-11-04T08:42:53Z
dc.date.issued2009-10-11
dc.identifier.citationp.2F 1 - 2F 9en_US
dc.identifier.isbn978-967-5415-07-4
dc.identifier.urihttp://dspace.unimap.edu.my/123456789/7177
dc.descriptionOrganized by School of Mechatronic Engineering (UniMAP) & co-organized by The Institution of Engineering Malaysia (IEM), 11th - 13th October 2009 at Batu Feringhi, Penang, Malaysia.en_US
dc.description.abstractIn this paper the exact solution for a functionally graded thermo-piezoelectric cylinder is developed. The displacement and stress distributions are derived due to heat source effect. The material properties and piezoelectric constants are varying continuously in the thickness, according to the power functions of radial direction. A direct method of solution of Navier equation is presented and temperature, displacement, stresses and electric potential distributions are obtained.en_US
dc.language.isoenen_US
dc.publisherUniversiti Malaysia Perlisen_US
dc.relation.ispartofseriesProceedings of International Conference on Applications and Design in Mechanical Engineering 2009 (iCADME 2009)en_US
dc.subjectThermo-elasticityen_US
dc.subjectPiezothermoelasticityen_US
dc.subjectFunctionally graded materialsen_US
dc.subjectHollow cylinderen_US
dc.subjectPiezoelectricityen_US
dc.subjectPiezoelectric devicesen_US
dc.titleHeat source effect in a functionally graded thermopiezoelectric hollow cylinderen_US
dc.typeWorking Paperen_US


Files in this item

Thumbnail

This item appears in the following Collection(s)

Show simple item record