dc.contributor.author | Nurehansafwanah, Khalid | |
dc.contributor.author | Siti Zuraidah, Ibrahim | |
dc.contributor.author | Fwen Hoon, Wee | |
dc.date.accessioned | 2021-01-06T00:50:29Z | |
dc.date.available | 2021-01-06T00:50:29Z | |
dc.date.issued | 2017 | |
dc.identifier.citation | MATEC Web of Conferences, vol.140, 2017, 4 pages | en_US |
dc.identifier.issn | 2261-236X (online) | |
dc.identifier.uri | http://dspace.unimap.edu.my:80/xmlui/handle/123456789/69246 | |
dc.description | Link to publisher's homepage at https://www.matec-conferences.org/ | en_US |
dc.description.abstract | This paper shows designed coupler on paper-substrate with Substrate Integrated Waveguide (SIW) techniques. Types of paper-substrate that used are photographic paper. The rectangular coupler is presented with Substrate Integrated Waveguide (SIW) which metallic via on paper-substrate. The structures of the coupler are designed and analysed using Computer Simulation Tools (CST) Studio Suite 2014 Software. This designed coupler operating within frequency of 3.8-5 GHz. The paper-based substrates are permits the implementation of green materials (Eco-friendly) technology. The design of the coupler and its simulated results are reported in this paper. | en_US |
dc.language.iso | en | en_US |
dc.publisher | EDP Sciences | en_US |
dc.relation.ispartofseries | 2017 International Conference on Emerging Electronic Solutions for IoT (ICEESI 2017); | |
dc.subject | Substrate Integrated Waveguide (SIW) | en_US |
dc.title | Substrate Integrated Waveguide (SIW) Coupler on Green Material Substrate for Internet of Things (IoT) Applications | en_US |
dc.type | Article | en_US |
dc.identifier.doi | https://doi.org/10.1051/matecconf/201714001022 | |
dc.contributor.url | nurehansafwanah@yahoo.com | en_US |