| dc.contributor.author | Mohd Khairuddin, Md Arshad | |
| dc.contributor.author | Ibrahim, Ahmad | |
| dc.contributor.author | Azman, Jalar | |
| dc.contributor.author | Uda, Hashim | |
| dc.date.accessioned | 2009-07-07T04:38:21Z | |
| dc.date.available | 2009-07-07T04:38:21Z | |
| dc.date.issued | 2005-12-06 | |
| dc.identifier.uri | http://dspace.unimap.edu.my/123456789/6339 | |
| dc.description | Organized by Universiti Putra Malaysia (UPM), 6th - 8th December 2005 at Putra World Trade Centre (PWTC), Kuala Lumpur. | en_US |
| dc.description.abstract | The low cost deposition of under bump metallurgy (UBM) method presented in this paper is based on electroless nickel immersion gold (ENIG) bumping process. The study is focuses on the effect of temperature, pH and exposure time to the deposition of nickel thickness. Metallurgical cross-section and image capturing system were used as analytical tools. Result suggests that with the increase of temperature, pH and exposure time, the nickel thickness also increased. | en_US |
| dc.language.iso | en | en_US |
| dc.publisher | Universiti Putra Malaysia (UPM) | en_US |
| dc.relation.ispartofseries | International Advanced Technology Congress | en_US |
| dc.subject | Under bump metallurgy (UBM) | en_US |
| dc.subject | Wafer bumping | en_US |
| dc.subject | Electroless nickel immersion gold (ENIG) | en_US |
| dc.subject | Surface roughness | en_US |
| dc.subject | Electroless deposition | en_US |
| dc.subject | Nickel-plating | en_US |
| dc.title | The effect of temperature, pH and exposure time to Electroless Nickel Deposition for Under Bump Metallurgy (UBM) | en_US |
| dc.type | Working Paper | en_US |
