Now showing items 1-2 of 2
Cu-SiCp composites as advanced electronic packaging materials
(Trans Tech Publications, 2014)
The demand for advanced thermal management materials such as silicon carbide particles reinforced copper matrix (Cu-SiCp) composites is increasing due to the stringent design requirement in the electronic packaging industries. ...
Thermal expansion behavior of the electroless copper coated Cu-SiCp composites fabricated via the conventional powder metallurgical technique
(Trans Tech Publications, 2014-01)
The introduction of the metal matrix composites as the advanced electronic packaging materials is highly anticipated because their thermal properties can be engineered to match those of semiconductors, ceramics substrates ...