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    Cu-SiCp composites as advanced electronic packaging materials 

    Azmi, Kamardin; Mohd Nazree, Derman, Dr.; Mohd Mustafa Al Bakri, Abdullah; Sandu, A.V. (Trans Tech Publications, 2014)
    The demand for advanced thermal management materials such as silicon carbide particles reinforced copper matrix (Cu-SiCp) composites is increasing due to the stringent design requirement in the electronic packaging industries. ...
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    Thermal expansion behavior of the electroless copper coated Cu-SiCp composites fabricated via the conventional powder metallurgical technique 

    Azmi, Kamardin; Mohd Nazree, Derman, Dr.; Mohd Mustafa Al-Bakri, Abdullah; Sandu, A.V. (Trans Tech Publications, 2014-01)
    The introduction of the metal matrix composites as the advanced electronic packaging materials is highly anticipated because their thermal properties can be engineered to match those of semiconductors, ceramics substrates ...

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    AuthorAzmi, Kamardin (2)Mohd Nazree, Derman, Dr. (2)Sandu, A.V. (2)Mohd Mustafa Al Bakri, Abdullah (1)Mohd Mustafa Al-Bakri, Abdullah (1)Subject
    Electroless copper (2)
    Copper matrix composites (1)Electronic packaging materials (1)Metal matrix composite (MMC) (1)Silicon carbide particles (1)... View MoreDate Issued
    2014 (2)

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