This paper presents the evaluation of the stress and strain response of the copper ball bond during wire bond shear test using finite element analysis. A 3D non-linear finite element model was developed for the simulation. ...

Wire bonding process is first level interconnection technology used in the semiconductor packaging industry. The wire bond shear tests are used in the industry to examine the bond strength and reliability of the bonded ...

This paper presents the simulation of gold wire bond shear test. The stress and strain response of the gold ball bond during wire bond shear was examined. The simulation was done using a A 3D non-linear finite element ...