This paper presents the evaluation of the stress and strain response of the copper ball bond during wire bond shear test using finite element analysis. A 3D non-linear finite element model was developed for the simulation. ...

The silica microchannel fabrication process has been executed with Al thin films as the sacrificial layer during Reactive Ion Etching Process (RIE). CF4/Ar and SF6/Ar plasmas has been used to investigate etch rate of Al ...

Ball grid array is an interconnection method widely used in the electronic packaging industry. The reliability of the solder ball is being improved by introducing new materials for the solder ball. In this study, the stress ...