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    Wire bond shear test simulation on hemispherical surface bond pad 

    Zaliman, Sauli, Dr.; Retnasamy, Vithyacharan; Wan Mokhzani, Wan Norhaimi; Johari, Adnan, Assc. Prof. Dr.; Palianysamy, Moganraj (Trans Tech Publications, 2012-12)
    Wire bonding process is an interconnection method adopted in the semiconductor packaging manufactory. One of the method used to assess the reliability and bond strength of the bonded wires are wire bond shear test .In this ...

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    Author
    Johari, Adnan, Assc. Prof. Dr. (1)
    Palianysamy, Moganraj (1)
    Retnasamy, Vithyacharan (1)
    Wan Mokhzani, Wan Norhaimi (1)
    Zaliman, Sauli, Dr. (1)SubjectANSYS (1)Hemisphere surface bond pad (1)Shear test (1)Wire bond (1)... View MoreDate Issued
    2012 (1)

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