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    Aluminium surface grain size analysis on RIE treatment 

    Zaliman, Sauli, Dr.; Retnasamy, Vithyacharan; Fairul Afzal, Ahmad Fuad; Ehkan, Phaklen, Dr.; Palianysamy, Moganraj; Aaron, Koay Terr Yeow (Trans Tech Publications (TTP), 2013)
    Reactive Ion Etch (RIE) has been an important process in the world of microelectronic fabrication. Focus of this preliminary study is on how RIE affects the grain size of aluminum film which is fabricated on substrates. ...
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    Interrogation of surface roughness and bond force effect 

    Zaliman, Sauli, Dr. (AENSI Publisher All rights reserved, 2013-10)
    In the macro world surface roughness is a feature undoubtedly not to be ignored. In the current trend towards the nano-scale feature in the devices related to the semiconductor and other various niche, surface roughness ...
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    Relationship between controllable process parameters on bump height in ENIG 

    Zaliman, Sauli, Dr.; Retnasamy, Vithyacharan; Fairul Afzal, Ahmad Fuad; Ehkan, Phaklen, Dr.; Muhamad Hafiz,  Ab Aziz (Trans Tech Publications, 2013)
    This paper reports the factors that affect the bump height in electroless nickel immersion gold (ENIG) and their interrelation between each other. Bump height is a critical issue that needs to be investigated because a ...
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    Nuclear matter and surface clustering 

    Qamar Nasir, Usmani, Prof. Dr.; Nooraihan, Abdullah; Khairul Anwar, Mohamad Khazali; Zaliman, Sauli, Dr. (IOP Publishing Ltd, 2013)
    We demonstrate that the binding energy per nucleon of symmetric nuclear matter (SNM) (with Coulomb interaction switched off and N Z) in the limit of zero density approaches to its value, uv, at the saturation density, where ...
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    LED heat dissipation study using different Cu slug size 

    Vairavan, Rajendaran; Retnasamy, Vithyacharan; Zaliman, Sauli, Dr.; Kamarudin, Hussin, Brig. Jen. Dato' Prof. Dr. (AENSI Publisher All rights reserved, 2013-10)
    High power light emitting diodes (LEDs) have significant contribution in illumination industry due exceptional advantages in terms of low power consumption, superior reliability, prolonged life time and high efficiency. ...
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    A comparative analysis between logarithmic number system and floating-point ALU 

    Rizalafande, Che Ismail, Dr.; Coleman, John Nicholas; Norzahiyah, Nordin; Zaliman, Sauli, Dr. (AENSI Publisher All rights reserved, 2013-10)
    The ease and accuracy of executing the multiplication and division operations by using either fixed-point addition or subtraction is what makes the logarithmic number system an attractive option. However, its main drawback ...
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    High power LED heat dissipation analysis via copper diamond slug 

    Vairavan, Rajendaran; Zaliman, Sauli, Dr.; Retnasamy, Vithyacharan; Kamarudin, Hussin, Brig. Jen. Dato' Prof. Dr. (AENSI Publisher All rights reserved, 2013-10)
    The emergence of high power light emitting diode as a novel electronic based light source is due to its vast advantage in terms of optical efficacy, low power consumption and enhanced life time. However, the performances ...
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    Shear strain analysis in FSS microchannel 

    Zaliman, Sauli, Dr.; Retnasamy, Vithyacharan; Nor Shakirina, Nadzri; Tan, Hsio Mei; Kamarudin, Hussin, Brig. Jen. Dato' Prof. Dr. (AENSI Publications, 2013-10)
    Microfluidics has motivated the development of various fields in biological engineering due to its advantages. The favorable benefits of using microfluidicsare being easy to fabricate, requirement of minimal fluid volumes, ...
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    Cylindrical shape slug heat conduction numerical analysis using copper material 

    Zaliman, Sauli, Dr.; Retnasamy, Vithyacharan; Kamarudin, Hussin, Brig. Jen. Dato' Prof. Dr.; Vairavan, Rajendaran (AENSI Publications, 2013-10)
    High power light emitting diodes have the edge over the conventional lighting system in terms of efficiency, low energy consumption and long operational lifetime. Nevertheless, the heat dissipation issue of the high power ...
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    Bump height at low temperature analysis 

    Zaliman, Sauli, Dr.; Retnasamy, Vithyacharan; Fairul Afzal, Ahmad Fuad; Ehkan, Phaklen, Dr.; Steven, Taniselass (Trans Tech Publications (TTP), 2013)
    The effects of chemical bath time in response to the bump height in electroless nickel immersion gold (ENIG) process was investigated. This paper presents the correlation between electroless process time, immersion gold ...
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    AuthorZaliman, Sauli, Dr. (23)Retnasamy, Vithyacharan (18)Kamarudin, Hussin, Brig. Jen. Dato' Prof. Dr. (10)Vairavan, Rajendaran (6)Ehkan, Phaklen, Dr. (5)... View MoreSubjectAnsys (6)Junction temperature (4)DOE (3)Forward facing step (3)Ku-band (3)... View MoreDate Issued
    2013 (24)

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