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Natural heat convection analysis on cylindrical Al slug of LED
(Trans Tech Publications, 2014-01)
This paper presents the characterization of a single chip high power LED package through simulation. Ansys version 11 was used for the simulation. The characterization of the LED package with aluminum cylindrical heat slug ...
5mm × 5mm sized slug on high power LED stress and junction temperature analysis
(Trans Tech Publications (TTP), 2013)
Conventional incandescent lamps are being replaced by high power light emitting diode as a lighting source due to it ascendancy in terms of physical size, performance, output and lifetime. Nevertheless, the reliability and ...