Now showing items 1-2 of 2
Shear ram speed characterization for copper wire bond shear test
(Trans Tech Publications, Switzerland., 2012)
This paper presents the evaluation of the stress and strain response of the copper ball bond during wire bond shear test using finite element analysis. A 3D non-linear finite element model was developed for the simulation. ...
Silica microchannel fabrication using fluorine based rie with alas a mask
(INSInet Publications, 2012-09)
The silica microchannel fabrication process has been executed with Al thin films as the sacrificial layer during Reactive Ion Etching Process (RIE). CF4/Ar and SF6/Ar plasmas has been used to investigate etch rate of Al ...