Browsing Mohd Mustafa Al Bakri Abdullah, Prof. Dr. by Subject "Thermal management"

Now showing items 1-3 of 3

    • Development of nano-material (nano-silver) in electronic components application 

      Mazlan, Mohamed; Anizah, Kalam, Dr.; Nik Rosli, Abdullah, Dr.; Loo, Huck Soo, Prof. Madya Ir. Dr.; Mohd Mustafa Al Bakri, Abdullah; M. S., Abdul Aziz; Khor, C. Y.; Mohammad Amizi, Ayob; Mohd Sukhairi, Mat Rasat (AENSI Publisher All rights reserved, 2013-10)
      This paper presents the development of nano-material in electronic components especially in Plastic Leaded Chip Carrier (PLCC) application. The effect of nano-material in Plastic Leaded Chip Carrier (PLCC)will improve ...

    • The effect of gap between plastic leaded chip carrier (PLCC) using computational fluid dynamic (CFD) software, FLUENT™ 

      Mazlan, Mohamed; Anizah, Kalam, Dr.; Nik Rosli, Abdullah, Dr.; Loo, Huck Soo, Prof. Madya Ir. Dr.; Mohd Mustafa Al Bakri, Abdullah; M. S., Abdul Aziz; Khor, C. Y.; Mohammad Amizi, Ayob; Mohd Sukhairi, Mat Rasat (AENSI Publisher All rights reserved, 2013-10)
      This paper presents the effect of gap between Plastic Leaded Chip Carrier (PLCC) by using three dimensional numerical analysis of heat and fluid flow in computer. 3D model of microprocessors is built using GAMBIT and ...

    • Three dimensional simulation of thermal pad using nanomaterial, nano-silver in semiconductor and electronic component application 

      Mazlan, Mohamed; Rahim, Atan, Prof. Madya Dr.; Mohd Mustafa Al Bakri, Abdullah; Muhammad Iqbal, Ahmad; Mohd Huzaifah, Yusoff; Fathinul Najib, Ahmad Saad (Trans Tech Publications, 2013)
      Thermal pad is new technology in this world that been used in PLCC in order to reduce junction temperature to the minimum level in electronic components. In electronic industry, the electronic components that exceed 70°C ...