Now showing items 1-2 of 2

    • Compaction optimization of Sn-Cu-Si3N4via powder metallurgy route for composite solder fabrication 

      Muhamad Hafiz, Zan @ Hazizi; Mohd Arif Anuar, Mohd Salleh; Zainal Arifin, Ahmad, Prof.; Mohd Mustafa Al-Bakri, Abdullah; Alida, Abdullah; Kamarudin, Hussin, Brig. Jen. Dato' Prof. Dr. (Trans Tech Publications, 2013)
      The aim of this study was to optimize the compaction process of a composite solder fabricated via powder metallurgy route, before details study were conducted in the next stage. Powder of Sn, Cu and Si3N4 were carefully ...
    • Mechanical properties of Sn-0.7Cu/Si 3N 4 lead-free composite solder 

      Mohd Arif Anuar, Mohd Salleh; Mohd Mustafa Al-Bakri, Abdullah; Muhammad Hafiz, Zan Hazizi; Flora, Somidin; Noor Farhani, Mohd Alui; Zainal Arifin, Ahmad, Prof. (Elsevier B.V., 2012-10)
      The use of reinforcing high performance ceramic particulates in monolithic lead-free solder is one way to improve the service temperature and mechanical behavior of a solder joint. In this study, various compositions of ...