Browsing Mohd Arif Anuar Mohd Salleh, Associate Professor Dr. Ir. by Author "k.nogita@uq.edu.au"
Now showing items 1-3 of 3
-
A comparative study of solder properties of Sn-0.7Cu lead-free solder fabricated via the powder metallurgy and casting methods
Mohd Arif Anuar, Mohd Salleh; Mohd Mustafa Al Bakri, Abdullah; Sandu, Andrei Victor; Norainiza, Saud; Kamarudin, Hussin, Brig. Jen. Dato' Prof. Dr.; McDonald, Stuart D.; Nogita, Kazuhiro (Syscom 18 SRL, 2013-07)The properties of Sn-0.7Cu solder bulk prepared via the powder metallurgy (PM) method were investigated and compared with solder bulk fabricated through casting. Distinct microstructures were observed in both PM and casting ... -
The effect of Bi on the microstructure, electrical, wettability and mechanical properties of Sn-0.7Cu-0.05Ni alloys for high strength soldering
Mohd Izrul Izwan, Ramli; Mohd Arif Anuar, Mohd Salleh; H., Yasuda; J., Chaiprapa; K., Nogita (Elsevier, 2019-10)This paper elucidated the effects of the Bi element (0 wt%, 0.5 wt% and 1.5 wt%) on the microstructure, electrical, wettability and mechanical properties of the Sn-0.7Cu-0.05Ni as a high strength solder. Besides using the ... -
Non-metal reinforced lead-free composite solder fabrication methods and its reinforcing effects to the suppression of intermetallic formation: short review
Mohd Arif Anuar, Mohd Salleh; McDonald, Stuart D.; Nogita, Kazuhiro (Trans Tech Publications, 2013)To increase the solder joint robustness, researches and studies on composite solder carried out by many researchers in an effort to develop viable lead-free solders which can replace the conventional lead-based solders. ...